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含苯并噁唑结构聚酰亚胺薄膜的制备与性能研究

作者:韩松锋1,唐必连2,青双桂2,马传国1(1.桂林电子科技大学材料科学与工程学院,广西桂林541004;2.桂林电器科学研究院有限公司,广西桂林541004)

摘要:为了制备满足新型电子封装材料相关性能要求的联苯型聚酰亚胺(PI)薄膜,将含有苯并噁唑结构单元的2-(4-氨基苯基)-5-氨基苯并噁唑(DAPBO)引入到以3,3′,4,4′-联苯四甲酸二酐(s-BPDA)、对苯二胺(PDA)和4,4′-二氨基二苯醚(ODA)为单体合成的分子结构中,通过无规共聚法制备聚酰胺酸(PAA),再进行亚胺化得到PI薄膜,并表征其相关性能。结果表明:通过引入DAPBO二胺单体,该系列PI薄膜的多项物理性能得到显著改善。其中,DAPBO含量的增加促使该系列PI薄膜的力学性能和热学性能提高,而热膨胀系数(CTE)减小。当二胺单体中DAPBO的含量达到100%时,PI薄膜的拉伸强度可达278MPa,CTE可降至7.47×10-6/K。

关键词:聚酰亚胺薄膜;苯并噁唑;无规共聚;物理性能

中图分类号:TM215;TQ323.7

文献标志码:A

文章编号:1009-9239(2019)01-0001-05

DOI:10.16790/j.cnki.1009-9239.im.2019.01.001


Preparation and Properties of PI Films with Benzoxazole Structure

HAN Songfeng1, TANG Bilian2, QING Shuanggui2, MA Chuanguo1(1. School of Material Science and Engineering, Guilin University of Electronic Technology, Guilin 541004, China; 2. Guilin Electrical Equipment Scientific Research Institute Co., Ltd., Guilin 541004, China)

Abstract: In order to meet the requirements of new electronic packaging materials on the polyimide (PI) film, a serial of biphenyl-type PI films were prepared and their properties were characterized. At first, polyamide acids (PAA) were synthesized via random copolymerization from 2-(4-aminophenyl)-5-aminobenzoxazole (DAPBO) containing benzoxazole unit, 3,3′ ,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA), p-phenylenediamine (PDA), and 4,4′-diaminodiphenyl ether (ODA, And then, PI films were obtained through imidization. The results show that several physical properties of the PI films were improved significantly by introducing the diamine monomer of DAPBO. With the increase of DAPBO content, the mechanical and thermal properties increase, while the thermal expansion coefficient (CTE) decreases. When the content of DAPBO in the diamine monomers is 100%, the tensile strength of the PI film attains 278 MPa, and the CTE decreases to 7.47×10-6/K.

Key words: polyimide film; benzoxazole; random copolymerization; physical property

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